Details, datasheet, quote on part number: THS3001
CategorySemiconductors => Amplifiers => Operational Amplifiers (Op Amps) => High-Speed Op Amps (>=50MHz)
Part familyTHS3001 420-MHz Current-Feedback Amplifier
Description420-MHz Current-Feedback Amplifier 8-SOIC 0 to 70
CompanyTexas Instruments, Inc.
DatasheetDownload THS3001 datasheet
Cross ref.Similar parts: AD811, AD8011-EB, AD8011XN, AD8014AR, AD8014AR-REEL, AD8014AR-REEL7, AD8014ART, AD8014ART-REEL, AD8014ART-REEL7, AD8108-EB
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Vn at 1kHz(Typ)(nV/rtHz)1.6
Input Bias Current(Max)(pA)10000000
Output Current(Typ)(mA)120
3rd Harmonic(dBc)80
Iq per channel(Max)(mA)9
Vos (Offset Voltage @ 25C)(Max)(mV)3
ArchitectureBipolar,Current FB
BW @ Acl(MHz)420
Total Supply Voltage(Min)(+5V=5, +/-5V=10)9
@ MHz10
Acl, min spec gain(V/V)1
Package GroupMSOP-PowerPAD,SOIC
Vn at Flatband(Typ)(nV/rtHz)1.6
2nd Harmonic(dBc)80
Operating Temperature Range(C)-40 to 85,0 to 70
Number of Channels(#)1
Total Supply Voltage(Max)(+5V=5, +/-5V=10)33
Approx. Price (US$)4.60 | 1ku
Iq per channel(Typ)(mA)6.6
Offset Drift(Typ)(uV/C)5
Slew Rate(Typ)(V/us)6500
  Mecanical Data
Pin nbPackage typeInd stdJEDEC codePackage qtyCarrierDevice markWidth (mm)Length (mm)Thick (mm)Pitch (mm)
8DSOICR-PDSO-G75TUBE3001C 3.914.91.581.27
Application notes
• Voltage Feedback vs. Current Feedback Op Amps
This application report contrasts and compares the characteristics and capabilities of voltage and current feedback operational amplifiers. The report also points out the many similarities between the two versions. | Doc
• THS3001 SPICE Model Performance
This application report outlines the SPICE model of the THS3001 high-speed monolithic operational amplifier. General information about the model file structure, performance comparison, model listing, and a brief comment about symbols are included. The list | Doc
• Load Sharing Concepts: Implementation for Large-Signal Applications
Selecting a suitable large-signal swing operational amplifier driver for instrumentation or test and measurement applications can be challenging. In addition to developing the necessary theoretical background for load sharing, this report provides bench re | Doc
• Analysis of the Sallen-Key Architecture (Rev. B)
This application report discusses the Sallen-Key architecture. The report gives a general overview and derivation of the transfer function, followed by detailed discussions of low-pass and high-pass filters, including design information, and ideal and non- | Doc
• Large-Signal Specifications for High-Voltage Line Drivers
Output voltage swing, output current, and slew rate interact with many other specifications in operational amplifiers. This application note develops the definitions for each parameter and the relationship between important ac parameters such as large-sign | Doc
• A Numerical Solution to an Analog Problem
In order to derive a solution for an analog circuit problem, it is often useful to develop a model. This approach is generally accepted as developing an analytical model. However, finding the analytical solution is not always practical or possible as a res | Doc
• Noise Analysis for High Speed Op Amps (Rev. A)
As system bandwidths have increased, an accurate estimate of the noise contribution for each element in the signal channel has become increasingly important. Many designers are not, however, particularly comfortable with the calculations required to predic | Doc
• Building a Simple SPICE Model for the THS3001
The application report Voltage Feedback Versus Current Feedback Op Amps SLVA051 outlines the basic operation of a current feedback operational amplifier (op amp) in relation to a voltage feedback op amp. One of the basic principles of a current feedback op | Doc
• PowerPAD™ Thermally Enhanced Package (Rev. G) | Doc
• Wireline Data Transmission and Reception
Many types of wires are widely used to transmit data. Specifically, Category 3 and Category 5 (Cat3 and Cat5e, respectively)—also known as unshielded twisted pair or UTP lines—are now recommended for new telephone installations. Coaxial (coax) cables a | Doc
• Driving Capacitance with the THS3001
Operational amplifiers (op amps) are often used to drive devices that present significant capacitance such as analog-to-digital converters, cables, MOSFETs, filter networks, etc. The effect of the added capacitance is to cause extra phase shift, which tend | Doc
• Gain Block Analysis For The THS3001
This report describes how to construct a gain block diagram for a current feedback op amp and relates the diagram to stability and gain analysis using parameters of the THS3001 op amp. | Doc
Evaluation Kits
DAC904EVM: DAC904 14-Bit 165-MSPS Digital-to-Analog Converter (DAC) Evaluation Module
THS3001EVM: THS3001 High Speed Amplifier Evaluation Modules
DAC908EVM: DAC908 8-Bit 165-MSPS Digital-to-Analog Converter (DAC) Evaluation Module
THS3112EVM: THS3112EVM Evaluation Module
DAC900EVM: DAC900 10-Bit 165-MSPS Digital-to-Analog Converter (DAC) Evaluation Module
DAC902EVM: DAC902 12-Bit 165-MSPS Digital-to-Analog Converter (DAC) Evaluation Module
Spice Model
THS3001 PSpice Model (Rev. A) - ZIP (02/03/2003)


Features, Applications


High Speed ­ 420 MHz Bandwidth 1, -3 dB) ­ 6500 V/µs Slew Rate ­ 40-ns Settling Time (0.1%) High Output Drive, 100 mA Excellent Video Performance ­ 115 MHz Bandwidth (0.1 dB, G Differential Gain ­ 0.02° Differential Phase Low 3-mV (max) Input Offset Voltage Very Low Distortion ­ THD = -96 dBc = 1 MHz ­ THD = -80 dBc = 10 MHz Wide Range of Power Supplies ­ VCC ±16 V Evaluation Module Available


THS6022 290-MHz VFB High-Speed Amplifier 500-mA CFB HIgh-Speed Amplifier 250-mA CFB High-Speed Amplifier


The is a high-speed current-feedback operational amplifier, ideal for communication, imaging, and high-quality video applications. This device offers a very fast 6500-V/µs slew rate, a 420-MHz bandwidth, and 40-ns settling time for large-signal applications requiring excellent transient response. In addition, the THS3001 operates with a very low distortion of ­96 dBc, making it well suited for applications such as wireless communication basestations or ultrafast ADC or DAC buffers.


These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

PACKAGED DEVICE TA SOIC (D) THS3001HVIDR (1) MSOP (DGN) THS3001HVIDGN THS3001HVIDGNR BNJ ADQ BNK ADP MSOP SYMBOL TRANSPORT MEDIA, QUANTITY Rails, 75 Tape and Reel, 2500 Rails, 75 Tape and Reel, 2500 Rails, 75 Tape and Reel, 2500 Rails, 75 Tape and Reel, 2500 EVALUATION MODULE THS3001EVM

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at

over operating free-air temperature range (unless otherwise noted)

THS3001 VSS VI IO VID TJ Supply voltage, VCC+ to VCCInput voltage Output current Differential input voltage Continuous total power dissipation Maximum junction temperature

Maximum junction temperature, continuous operation, long term
Storage temperature Lead temperature mm (1/16 inch) from case for 10 seconds

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. The absolute maximum temperature under any condition is limited by the constraints of the silicon process. The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device.

This data was taken using the JEDEC standard High-K test PCB. Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long term reliability.

MIN Split supply VSS Supply voltage, VCC+ and VCCSingle supply Split supply Single supply TA Operating free-air temperature THS3001HVC, THS3001HVI NOM MAX °C V UNIT

PARAMETER TEST CONDITIONS (1) Split supply VCC Power supply operating range Single supply THS3001I THS3001HVx VCC ±5 V ICC Quiescent current VCC ±15 V VCC V, THS3001HV VCC V VO Output voltage swing VCC V IO VIO Output current (2) Input offset voltage Input offset voltage drift Positive (IN+) IIB Input bias current Negative (IN-) VICR Common-mode input voltage range Open loop transresistance CMRR Common-mode rejection ratio VCC ±5 V VCC ±15 V VCC 1 k VCC 1 k VCC ±5 V, VCM ±2.5 V VCC ±15 V, VCM ±10 V VCC ±5 V PSRR Power supply rejection ratio VCC TA = full range TA = full range VCC ±15 V VCC ±5 V, VCC ±15 V, VCC ±15 V VCC TA = full range TA = full range TA = full range TA = full range TA = full range TA = full range mA mV µV/°C 6.9 6.6 MIN TYP MAX mA V UNIT

Full range to 70°C for the THS3001C and to 85°C for the THS3001I. Observe power dissipation ratings to keep the junction temperature below absolute maximum when the output is heavily loaded or shorted. See absolute maximum ratings section. 3


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