Details, datasheet, quote on part number: TPS79928
PartTPS79928
CategoryPower Management => Regulators => Linear Regulators => LDO (Low Drop Out)
Description200mA Low Quiescent Current, Ultra-Low Noise, High PSRR LDO

The TPS799xx family of low-dropout (LDO) low-power linear regulators offer excellent AC performance with very low ground current. High power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient response are provided while consuming a very low 40µA (typical) ground current. The TPS799xx is stable with ceramic capacitors and uses an advanced BiCMOS fabrication process to yield dropout voltage typically 110mV at 200mA output. The TPS799xx uses a precision voltage reference and feedback loop to achieve overall accuracy of 2% over all load, line, process, and temperature variations. It is fully specified from TJ = -40°C to +125°C and is offered in low profile ThinSOT23 and Wafer Chip-Scale packages (WCSP), ideal for wireless handsets and WLAN cards.
CompanyTexas Instruments, Inc.
DatasheetDownload TPS79928 datasheet
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Features, Applications

200mA Low Quiescent Current, Ultra-Low Noise, High PSRR, Low Dropout Linear Regulator
FEATURES

200mA Low Dropout Regulator with EN Low IQ: 40µA Available in Multiple Output Voltage Versions: ­ Fixed Outputs 3.0V, 3.2V and 3.3V ­ Adjustable Outputs from 6.5V ­ Additional Outputs Available Using Innovative Factory EEPROM Programming High PSRR: at 1kHz Ultra-low Noise: 29.5µVRMS Fast Start-Up Time: 45µs Stable with a 2.0µF Ceramic Output Capacitance Excellent Load/Line Transient Response 2% Overall Accuracy (Load/Line/Temp) Very Low Dropout: 100mV ThinSOT-23, WCSP, and x 2mm SON (Available 9/05) Packages

DESCRIPTION

The TPS799xx family of low-dropout (LDO) low-power linear regulators offer excellent AC performance with very low ground current. High power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient response are provided while consuming a very low 40µA (typical) ground current. The TPS799xx is stable with ceramic capacitors and uses an advanced BiCMOS fabrication process to yield dropout voltage typically at 200mA output. The TPS799xx uses a precision voltage reference and feedback loop to achieve overall accuracy of 2% over all load, line, process, and temperature variations. It is fully specified from to +125°C and is offered in low profile ThinSOT23 and Wafer Chip-Scale packages (WCSP), ideal for wireless handsets and WLAN cards.

APPLICATIONS
Cellular Phones Wireless LAN, BluetoothTM VCOs, RF Handheld Organizers, PDAs

TPS799xxDDC TSOT23-5 (TOP VIEW) TPS79901DDC TSOT23-5 (TOP VIEW) TPS799xxYZU WCSP PACKAGE (TOP VIEW) A1 TPS79901YZU WCSP PACKAGE (TOP VIEW) A3 A1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Bluetooth is a trademark of Bluetooth SIG, Inc. All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1)

PRODUCT TPS799xxyyyz VOUT XX is nominal output voltage (for example, 01 = Adjustable). YYY is package designator. Z is package quantity.

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Output voltages from in 50mV increments are available through the use of innovative factory EEPROM programming; minimum order quantities may apply. Contact factory for details and availability. PRODUCT TPS79932 TPS79933 VOLTAGE Adjustable 3.2V 3.3V PACKAGE-LEAD (DESIGNATOR) SOT23 (DDC) WCSP (YZU) SOT23 (DDC) WCSP (YZU) WCSP (YZU) SOT23 (DDC) WCSP (YZU) SOT23 (DDC) WCSP (YZU) WCSP (YZU) SOT23 (DDC) WCSP (YZU) SOT23 (DDC) WCSP (YZU) WCSP (YZU) SOT23 (DDC) WCSP (YZU) WCSP (YZU) SOT23 (DDC) WCSP (YZU) PACKAGE MARKING AWT E9 AWU EA F2 AWV EB AWW EC F5 AWX ED AXY EE EZ AXZ EF F4 AXX EG

Over operating temperature range (unless otherwise noted) (1)

PARAMETER VIN range VEN range VOUT range Peak output current Continuous total power dissipation Junction temperature range, TJ Storage junction temperature range , TSTG ESD rating, HBM ESD rating, CDM -0.3 to VIN -0.3 to VIN +0.3 Internally limited See Dissipation Ratings Table kV V UNIT V

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

BOARD Low-K (1) High-K (2) Low-K (1) High-K (1) (2) PACKAGE DDC YZU RJC 90°C/W 27°C/W RJA 255°C 190°C DERATING FACTOR ABOVE 155mW 215mW

The JEDEC low-K (1s) board used to derive this data was x 3in, two-layer board with 2-ounce copper traces on top of the board. The JEDEC high-K (2s2p) board used to derive this data was x 3in, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board.


 

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