Details, datasheet, quote on part number: MAX22500EATB+
PartMAX22500EATB+
Category
TitleRS-422/RS-485 Interface IC RS-485/RS-422 Transceiver
Description
CompanyIntegra Technologies
DatasheetDownload MAX22500EATB+ datasheet
  
MAX22500EATB+ photo

Others parts numbering
MAX22501EATA+: RS-422/RS-485 Interface IC RS-485/RS-423 Transceiver
MAX22501EEVKIT#: Interface Development Tools EVKIT for MAX22501
MAX22500EEVKIT#: Interface Development Tools EVKIT for MAX22500

 

Features, Applications

The MAX22500E/MAX22501E half-duplex ESD-protected RS-485/RS-422 transceivers are optimized for highspeed (up to 100Mbps) communication over long cables. These transceivers feature integrated hot-swap protection and a fail-safe receiver, ensuring a logic-high on the receiver output when input signals are shorted or open for longer than 10s (typ). The MAX22500E features integrated preemphasis circuitry that extends the distance and increases the data rate of reliable communication by reducing inter-symbol interference (ISI) caused by long cables. The MAX22500E features a flexible logic interface down to 1.6V. The MAX22501E operates without preemphasis and is powered from to 5.5V supply. The MAX22500E is available a 10-pin TDFN-EP package. The MAX22501E is available a 8-pin TDFN-EP package. Both transceivers operate over the to +125C ambient temperature range.

High-Speed Operation Over Long Distances to 100Mbps Data Rate Integrated Preemphasis Extends Cable Length (MAX22500E) High Receiver Sensitivity Wide Receiver Bandwidth Symmetrical Receiver Thresholds Integrated Protection Increases Robustness to +15V Common Mode Range 15kV ESD Protection (Human Body Model) 7kV IEC 61000-4-2 Air-Gap ESD Protection 6kV IEC 61000-4-2 Contact Discharge ESD Protection Driver Outputs are Short-Circuit Protected Flexibility for Many Different Applications to 5.5V Supply Range Low Voltage Logic Supply Down 1.6V (MAX22500E) Low 5A (max) Shutdown Current Available or 10-pin TDFN Package to +125C Operating Temperature Range

Applications
Motion Control Encoder Interfaces Field Bus Networks Industrial Control Systems Backplane Busses

+6 V RE, DE, DI, RO (MAX22500E only)............................... V to (VL RO (MAX22501E only).............................. -0.3V to (VCC + 0.3)V PSET......................................................... to +15V Short-Circuit Duration (RO, B) to GND..................Continuous Continuous Power Dissipation (TA +70C) (8-Pin TDFN (derate 24.4mW/C above +70C) )...........................1951mW

Continuous Power Dissipation (TA +70C) (10-Pin TDFN (derate 24.4mW/C above +70C) )...........................1951mW Operating Temperature Range......................... to +125C Junction Temperature......................................................+150C Storage Temperature Range............................ to +150C Lead Temperature (Soldering 10sec).............................. +300C Reflow Temperature........................................................ +270C

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE CODE Outline Number Land Pattern Number Thermal Resistance, Single-Layer Board: Junction to Ambient (JA) Junction to Case (JC) Thermal Resistance, Four-Layer Board: Junction to Ambient (JA) Junction to Case (JC) 90-0059 T833-2

PACKAGE CODE Outline Number Land Pattern Number Thermal Resistance, Single-Layer Board: Junction to Ambient (JA) Junction to Case (JC) Thermal Resistance, Four-Layer Board: Junction to Ambient (JA) Junction to Case (JC) 90-0061 T1033-2

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that or in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

(VCC 1.6V to VCC (MAX22500E only), VL VCC, TA = TMIN to TMAX, unless otherwise noted (Notes 1, 2)) PARAMETER POWER MAX22500E MAX22501E Supply Current Shutdown Supply Current Logic Supply Voltage Logic Supply Current DRIVER Differential Driver Output Differential Driver Preemphasis Ratio Change in Magnitude of Differential Output Voltage Driver Common-Mode Output Voltage Change In Magnitude of Common-Mode Voltage Single-Ended Driver Output High Single-Ended Driver Output Low Differential Output Capacitance Driver Short-Circuit Output Current RECEIVER Input Current (A and B) Differential Input Capacitance Common Mode Voltage Range Receiver Differential Threshold High IA,B CA,B VCM VTH_H -15V VCM DE = GND, VCC = GND, or 5.5V VIN = +12V VIN V mV VOD Figure 1, Figure 2 MAX22500E only, preemphasis enabled, 4.5V VCC 5.5V (Note = 100 RL= 54 RL= VCC/2 V/V V ICC ISHDN DE = high, RE= low, no load DE = low, RE= high MAX22500E only MAX22500E only, no load MAX22500E MAX22501E Preemphasis disabled Preemphasis enabled VCC A V SYMBOL CONDITIONS MIN TYP MAX UNITS

= 54, Figure 1 (Note = 54, Normal mode and preemphasis, Figure or 54, Figure 1 (Note or B output, IOUT or B output, IOUT DE = RE= high, 4MHz -15V VOUT +15V


 

Some Part number from the same manufacture Integra Technologies
MAX22501EATA+
MAX22501EEVKIT#
MAX22500EEVKIT#
 
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