Details, datasheet, quote on part number: DB1000-DB1010
PartDB1000-DB1010
CategoryDiscrete => Diodes & Rectifiers => Rectifier Diodes
Description
CompanyDiotec Electronics Corporation
DatasheetDownload DB1000-DB1010 datasheet
  

 

Features, Applications
18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
FEATURES

VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 300 AMPS PEAK

Case: Molded plastic, U/L Flammability Rating 94V-0 Terminals: Round silver plated copper pins

Soldering: Per MIL-STD 202 Method 208 guaranteed D1 Polarity: Marked on side of case; positive lead at beveled corner _ Mounting Position: Any. Through hole provided for #6 screw Weight: 0.18 Ounces (5.4 Grams) BL

Ratings 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive loads, derate current by 20%.

Series Number Maximum DC Blocking Voltage Working Peak Reverse Voltage Maximum Peak Recurrent Reverse Voltage RMS Reverse Voltage Power Dissipation in V(BR) Region for 100 µS Square Wave Continuous Power Dissipation in V(BR) Region THS=80o C (Heat Sink Temp) Thermal Energy (Rating for Fusing) Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). 50 C (Notes 50o C (Note 2) Junction Operating and Storage Temperature Range Average Forward Rectified Current

Minimum Avalanche Voltage Maximum Avalanche Voltage Maximum Forward Voltage (Per Diode) at 5 Amps DC

VRM VRWM VRRM VR (RMS) PRM PR I2t IFSM IO TJ, TSTG V(BR) Min V(BR) Max VFM 25o C @TA 100o C IRM VISO RJA RJC

Minimum Insulation Breakdown Voltage (Circuit to Case) Typical Thermal Resistance Junction to Ambient (Note 2) Junction to Case (Note 1)

NOTES: (1) Bridge mounted x 0.11" thick x 0.3cm) aluminum plate (2) Bridge mounted on PC Board with 0.5" sq. (12mm sq.) copper pads and bridge lead length (9.5mm) (3) Bolt bridge on heat sink with #6 screw, using silicon thermal compound between bridge and mounting surface for maximum heat transfer. (4) These bridges exhibit the avalanche characteristic at breakdown. If your application requires a specific breakdown voltage range, please contact us.

Temperature, oC FIGURE 1. FORWARD CURRENT DERATING CURVE
Number of Cycles 60 Hz FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
Instantaneous Forward Voltage (Volts) FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE
Percent of Rated Peak Reverse Voltage FIGURE 4. TYPICAL REVERSE CHARACTERISTICS

NOTES (1) Case Temperature, TC, With Bridge Mounted x 0.11" Thick x 0.3cm) Aluminum Plate Ambient Temperature, TA, With Bridge Mounted on PC Board With 0.5" Sq. (12mm Sq.) Copper Pads And Bridge Lead Length 150o C

25o C; Pulse Width 300µSec; 1% Duty Cycle = 1 MHz; Vsig = 50mVp-p
Reverse Voltage, (Volts) FIGURE 5. TYPICAL JUNCTION CAPACITANCE PER DIODE

 

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