|Category||RF & Microwaves => Attenuators|
|Description||DC-2 Ghz, 5-Bit GAAS Attenuator|
|Datasheet||Download MADA2030G datasheet
Attenuation 0.5-dB Steps 15.5 dB Temperature Stability ±0.1 dB from to +85°C Typical Fast Switching Speed, 3 ns Typical to 90%
Frequency Range Nominal Attenuation Accuracy - 2.0 GHz 0.5 dB Steps 15.5 dB Max ±3% of Attenuation Setting 1.6:1 Max 2.3 dB Max 1.9 dB MaxVSWR Worst Case Setting Reference Insertion Loss
Impedance 50 Nominal Phase Balance (For any bit or combinations of bits per unit) 2 GHz +4/-6 Degrees Typ 1 GHz +2/-3 Degrees Typ 500 MHz +1/-2 Degrees Typ Switching Characteristics Switching Time (50% CTL to 90/10% RF) Switching Transients (Unfiltered) Input Power for 1 dB Compression Above 500 MHz 100 MHz Intermodulation Intercept Point (for two-tone input power to +5 dBm) Intercept Points Above 500 MHz 100 MHz 3 ns Typ 7 mV Typ +27 dBm Typ +24 dBm TypControl Voltages (Complementary Logic) VINLow 5 µA Max VINHi 75 µA Typ 250 µA Max Die Size x 0.25mm
Handling, Mounting and Bonding Procedure Handling Precautions
Permanent damage to the MADA2030 may occur if the following precautions are not adhered to: A. Cleanliness The MADA2030 should be handled in a clean environment. DO NOT attempt to clean unit after the MADA2030 is installed. B. Static Sensitivity All chip handling equipment and personnel should be DC grounded. C. Transient Avoid instrument and power supply transients while bias is applied to the MADA2030. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias Apply voltage to either complementary control ports only when the other is grounded. Neither port should be allowed to "float". E. General Handling It is recommended that the MADA2030 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers.VinHi VinLow VinHi VinLow VinHi VinLow VinHi
The MADA2030 is back-metallized with Pd/Ni/Au (100/1,000/10,000Ĺ) metallization. It can be die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately B. DO NOT expose the to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MADA2030 into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used but is not required.VinHi VinLow VinHi VinLow Vin Low VinLow VinHi Vin Low VinLow VinHi VinLow Vin Low VinHi
Maximum Ratings A. Control Voltage : -8.5 Vdc B. Max Input RF Power: +34 dBm (500 MHz - 4 GHz) C. Storage Temperature: +175°C D. Maximum Operating Temperature: +175°C
A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermo- sonic wirebonding with a nominal stage temperature of 150°C and a ball bonding force to 50 grams or wedge bonding force to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended.
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