Details, datasheet, quote on part number: MC-4216LFG641
PartMC-4216LFG641
CategoryMemory => DRAM => EDO/FPM DRAM => Modules => 128 MB => EDO
TitleEDO
Description3.3v Operation 16m-word BY 64-bit Dynamic RAM Module Unbuffered Type, Edo
CompanyNEC Electronics Inc.
DatasheetDownload MC-4216LFG641 datasheet
  

 

Features, Applications

DESCRIPTION The µPD753304 is one of the 75XL series 4-bit single-chip microcontroller chips and has a data processing capability comparable to that an 8-bit microcontroller. Since it inherits the 75X series CPU, it has upward compatibility. While the conventional 75X series products with an on-chip LCD controller/driver use an 80-pin package, the µPD753304 is sold as a pellet/wafer to make it possible to be built into portable devices with an LCD display function, etc. For detailed function descriptions, refer to the following user's manual. µPD753304 User's Manual: U12020E FEATURES RC oscillation circuit on chip Main system clock: fCC = 3.6 MHz (typical value with 6.8-k external resistor connected. An internal 10-pF (typ.) capacitor is provided.) Subsystem clock : fCT = 47 kHz (typ.) (Both a resistor and a capacitor are provided internally.) Processing can be started immediately after standby mode is released. Oscillation of the subsystem clock can be stopped in STOP mode. Supply voltage: VDD 5.5 V On-chip memory Program memory (ROM) bits Data memory (RAM) bits Variable instruction execution time function useful for power saving µs (in fCC = 3.6 MHz operation) 85.1 µs (in fCT = 47 kHz operation) Programmable LCD controller/driver on chip Sold as a pellet/wafer to make it possible to be built into portable devices with an LCD display function APPLICATION Small LCD display device, etc. ORDERING INFORMATION Part Number µPD753304P-XXX µPD753304W-XXX

Caution The µPD753304 is sold as a pellet/wafer. However, an ES product in 42-pin ceramic shrink DIP is also available. Remark XXX is a ROM code suffix. For the pellet/wafer, consult NEC because an agreement concerning quality must be made.

The information in this document is subject to change without notice.
Document No. U11874EJ1V0DS00 (1st edition) Date Published October 1997 N Printed in Japan

Parameter Instruction execution time Function µs 3.6 MHz with main system clock) µs 47 kHz with subsystem clock) × 8 bits × 4 bits 4-bit operation: × 4 banks 8-bit operation: × 4 banks 12 On-chip pull-up resistors which can be specified by software: 4 Also used for segment pins: 4

20/24 segments (can be changed to CMOS input/output port in 4 time-unit; max. 4) Display mode selection: Static 1/2 duty (1/2 bias) 1/3 duty (1/2 bias) 1/3 duty (1/3 bias) 1/4 duty (1/3 bias) LCD display modes can be selected by mask option

channels 8-bit timer counter: 1 channel (with subclock source input function) Basic interval timer/watchdog timer: 1 channel Watch timer: 1 channel

Clock output (PCL) Buzzer output (BUZ)

, 3.6 MHz, 450 kHz, 225 kHz 3.6 MHz with main system clock) 5.88, 47 kHz 47 kHz with subsystem clock) 3.52, 28.13 kHz 3.6 MHz with main system clock) External: 1, Internal: 2 Internal: 1 Main system clock oscillation RC oscillation circuit (with external resistor and 10 pF (typ.) on-chip capacitor) Subsystem clock oscillation RC oscillation circuit (with on-chip resistor and capacitor) STOP mode/HALT mode VDD to +60 °C Volume production product: Pellet/wafer ES product (for evaluation): 42-pin ceramic shrink DIP (600 mil)

Vectored interrupts Test input System clock oscillation circuit
Standby function Supply voltage Operating ambient temperature Package

1. PIN CONFIGURATION............................................................................................................. 4 2. BLOCK DIAGRAM................................................................................................................... 7 3. PIN FUNCTIONS...................................................................................................................... 8 Port Pins.......................................................................................................................... 8 Non-Port Pins.................................................................................................................. 9 Pin Input/Output Circuits............................................................................................. 10 Recommended Connections for Unused Pins........................................................... 12

4. SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE............................ 13 4.1 Difference between Mk I and Mk II Modes.................................................................. 13 4.2 Setting Method of Stack Bank Select Register (SBS)............................................... 14 5. MEMORY CONFIGURATION................................................................................................. 15 6. PERIPHERAL HARDWARE FUNCTION.............................................................................. 18 6.1 Digital I/O Port............................................................................................................... 18 6.2 Clock Generator............................................................................................................ 18 6.3 Clock Output Circuit..................................................................................................... 20 6.4 Basic Interval Timer/Watchdog Timer......................................................................... 21 6.5 Watch Timer.................................................................................................................. 22 6.6 Timer Counter............................................................................................................... 23 6.7 LCD Controller/Driver................................................................................................... 24 7. INTERRUPT FUNCTION AND TEST FUNCTION.............................................................. 25 8. STANDBY FUNCTION............................................................................................................ 26 9. RESET FUNCTION................................................................................................................. 27 10. MASK OPTION..................................................................................................................... 30 11. INSTRUCTION SET.............................................................................................................. 31 12. ELECTRICAL SPECIFICATIONS........................................................................................ 41 13. CHARACTERISTIC CURVE (reference)............................................................................ 48 APPENDIX A.

APPENDIX B. DEVELOPMENT TOOLS.................................................................................. 51 APPENDIX C. RELATED DOCUMENTS.................................................................................. 53


 

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MC-4516DA72 16 M-word BY 72-bit Synchronous Dynamic RAM Module Registered Type
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