|Category||Logic => Gates => Bipolar->ECL 10 Family|
|Title||Bipolar->ECL 10 Family|
|Description||Hex Buffer With Enable|
|Datasheet||Download MC10188 datasheet
|Cross ref.||Similar parts: MC10188FN, MC10188FNR2, MC10188L|
The is a highspeed hex buffer with a common Enable input. When Enable is in the high state, all outputs are in the low state. When Enable is in the low state, the outputs take the same state as the inputs. Power Dissipation 180 mW typ/pkg (No Load) Propagation Delay 2.0 ns typ 2.5 ns typ Q)
CDIP16 L SUFFIX CASE PDIP16 P SUFFIX CASE PLCC20 FN SUFFIX CASE 775 10188 AWLYYWW MC10188P AWLYYWW
VCC1 AOUT BOUT COUT AIN BIN CIN VEE VCC2 FOUT EOUT DOUT FIN EIN DIN COMMON WW = Assembly Location = Wafer Lot = Year = Work Week
Device MC10188L MC10188P Package PDIP16 PLCC20 Shipping 25 Units / Rail 25 Units / Rail 46 Units / Rail
Pin assignment is for DualinLine Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D).Characteristic Power Supply Drain Current Input Current
Output Voltage Output Voltage Threshold Voltage Threshold Voltage Switching Times Propagation Delay Rise/Fall TimeLogic 1 Logic 0 Logic 1 Logic 0 (50 Load) Enable Data to 80%)
TEST VOLTAGE APPLIED TO PINS LISTED BELOW VIHmax VILmin VIHAmin VILAmax VEE
Logic 1 Logic 0 Logic 1 Logic 0 (50 Load) Enable Data to 80%)
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50ohm resistor to 2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.PLCC20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 77502 ISSUE C
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
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