Details, datasheet, quote on part number: MC10195P
PartMC10195P
CategoryLogic => Gates => Inverters Gates
DescriptionHex Inverter/Buffer, Package: Cdip, Pins=16
CompanyON Semiconductor
DatasheetDownload MC10195P datasheet
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Features, Applications

The is a Hex Buffer Inverter which is built using six EXCLUSIVE NOR gates. There is a common input to these gates which when placed low or left open allows them to act as inverters. With the common input connected to a high logic level the is a hex buffer, useful for high fanout clock driving and reducing stub lengths on long bus lines. 200 mW typ/pkg (No Load) tpd 2.8 ns typ (B­Q) tpd 3.8 ns typ (A­Q) tr, 2.5 ns typ (20%­80%)

CDIP­16 L SUFFIX CASE PDIP­16 P SUFFIX CASE 1 MC10195P AWLYYWW 1 10195 AWLYYWW MC10195L AWLYYWW
= Assembly Location = Wafer Lot = Year = Work Week

Pin assignment is for Dual­in­Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D).

Device MC10195P MC10195FN Package PDIP­16 PLCC­20 Shipping 25 Units / Rail 25 Units / Rail 46 Units / Rail

Characteristic Power Supply Drain Current Input Current
Output Voltage Output Voltage Threshold Voltage Threshold Voltage
Output Voltage Output Voltage Threshold Voltage Threshold Voltage Switching Times Propagation Delay

Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50­ohm resistor to ­2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.

PLCC­20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775­02 ISSUE C

NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).


 

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