Details, datasheet, quote on part number: M68AR256ML70ZB6E
PartM68AR256ML70ZB6E
Category
Description4 Mbit (256K X16) 1.8V Asynchronous SRAM
CompanyST Microelectronics, Inc.
DatasheetDownload M68AR256ML70ZB6E datasheet
  

 

Features, Applications

SUPPLY VOLTAGE: x 16 bits SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIME: 55ns, 70ns SINGLE BYTE READ/WRITE LOW STANDBY CURRENT LOW VCC DATA RETENTION: 1.0V TRI-STATE COMMON I/O AUTOMATIC POWER DOWN TFBGA48 PACKAGE Compliant with Lead-Free Soldering Processes Standard or Lead-Free Option

FEATURES SUMMARY. 1 Figure 1. Packages. 1 SUMMARY DESCRIPTION. 4 Figure 2. Table 1. Figure 3. Figure 4. Logic Diagram. 4 Signal Names. 4 TFBGA Connections (Top view through package). 5 Block Diagram. 6

OPERATION. 7 Output Disabled. 7 Read Mode. 7 Write Mode. 7 Standby/Power-Down Mode. 7 Table 2. Operating Modes. 8 MAXIMUM RATING. 9 Table 3. Absolute Maximum Ratings. 9 DC and AC PARAMETERS. 10 Table 4. Operating and AC Measurement Conditions. 10 Figure 5. AC Measurement I/O Waveform. 10 Figure 6. AC Measurement Load Circuit. 10 Table 5. Capacitance. 11 Table 6. DC Characteristics. 11 Figure 7. Address Controlled, Read Mode AC Waveforms. 11 Figure 8. Chip Enable or Output Enable Controlled, Read Mode AC Waveforms. 12 Figure 9. Chip Enable or UB/LB Controlled, Standby Mode AC Waveforms. 12 Table 7. Read and Standby Mode AC Characteristics. 13 Figure 10.Write Enable Controlled, Write AC Waveforms. 14 Figure 11.Chip Enable Controlled, Write AC Waveforms. 14 Figure 12.UB/LB Controlled, Write AC Waveforms. 15 Table 8. Write Mode AC Characteristics. 16 Figure 13.Low VCC Data Retention AC Waveforms. 17 Table 9. Low VCC Data Retention Characteristics. 17 PACKAGE MECHANICAL. 18 Figure - 6x8 active ball array, 0.75mm pitch, Bottom View Package Outline 18 Table - 6x8 active ball array, 0.75mm pitch, Package Mechanical Data. 18 PART NUMBERING. 19 Table 11. Ordering Information Scheme. 19

REVISION HISTORY. 20 Table 12. Document Revision History. 20

 

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