|Category||Power Management => Voltage References => Micropower|
|Description||1.24V Adjustable Shunt Voltage Reference|
|Company||ST Microelectronics, Inc.|
|Datasheet||Download TS432 datasheet
s HIGH STABILITY WHEN USED WITH s INDUSTRIAL TEMPERATURE RANGE:
s 100ppm/°C TEMPERATURE COEFFICIENT DESCRIPTION The is an adjustable low power shunt voltage reference providing an output voltage from to 10V over the industrial temperature range to +85°C). Available in SOT23-3 surface mount package, it can be designed in applications where space saving is a critical issue. The low operating current is a key advantage for power restricted designs. In addition, the TS432 is very stable and can be used in a broad range of application conditions. APPLICATIONComputers Instrumentation Battery chargers Switch Mode Power Supply Battery operated equipments
LT = Tiny Package (SOT23-3) - only available in Tape & Reel (LT)
Symbol VK IK IREF PD RTHJA TLEAD TSTG TJ ESD Cathode voltage Cathode current Reference input current Power dissipation
Thermal resistance junction to ambient for Lead temperature (soldering 10 seconds) Storage temperature Junction temperature Human Body Model (HBM) Machine Model (MM)
Symbol VK IK TAMB Cathode voltage Cathode current Ambient temperature Parameter Value to +85 Unit A °CELECTRICAL CHARACTERISTICS Tamb = 25°C (unless otherwise specified)
Symbol VREF IKMIN Parameter Reference voltage Reference voltage tolerance over temperature Minimum operating current Test Condition = 100µA, VK=VREF = 100µA, VK=VREF Tamb -40°C < TAMB < +85°C IKMIN < 1mA VREF Reverse breakdown voltage change with operating current range -40°C < TAMB -40°C < TAMB < +85°C VREF/ Reference voltage change with output voltage change VK IREF IOFF RKA KVH EN Reference input current Off-state cathode current Static impedance Long term stability Wide band noise VK=10V to VREF -40°C < TAMB -40°C < TAMB -40°C < TAMB < 10kHz Min. Typ. mV/V nA ppm nV/Hz mV V Max. Unit
Note : Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation and by design.
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