Extremely Low Offset Voltage. 1 µV Max Extremely Low Change on Offset Voltage With Temperature. 0.003 µV/°C Typ Low Input Offset Current 500 pA Max to 125°C AVD. 135 dB Min CMRR. 120 dB Min kSVR. 110 dB Min Single-Supply Operation Common-Mode Input Voltage Range Includes the Negative Rail No Noise Degradation With External Capacitors Connected to VDD ­

8 The TLC2652 and TLC2652A are high-precision chopper-stabilized operational amplifiers using FK PACKAGE Texas Instruments Advanced LinCMOS (TOP VIEW) process. This process, in conjunction with unique chopper-stabilization circuitry, produces opera tional amplifiers whose performance matches or exceeds that of similar devices available today. Chopper-stabilization techniques make possible NC 18 CLK OUT 4 extremely high dc precision by continuously NC 5 nulling input offset voltage even during variations ­ 16 VDD 6 in temperature, time, common-mode voltage, and NC 7 power supply voltage. In addition, low-frequency 14 OUT IN + noise voltage is significantly reduced. This high precision, coupled with the extremely high input impedance of the CMOS input stage, makes the TLC2652 and TLC2652A an ideal choice for low-level signal processing applications such as strain gauges, thermocouples, and other transducer amplifiers. For applications that ­ No internal connection require extremely low noise and higher usable bandwidth, use the or TLC2654A device, which has a chopping frequency of 10 kHz. The TLC2652 and TLC2652A input common-mode range includes the negative rail, thereby providing superior performance in either single-supply or split-supply applications, even at power supply voltage levels as low 1.9 V. Two external capacitors are required for operation of the device; however, the on-chip chopper-control circuitry is transparent to the user. On devices in the 14-pin and 20-pin packages, the control circuitry is made accessible to allow the user the option of controlling the clock frequency with an external frequency source. In addition, the clock threshold level of the TLC2652 and TLC2652A requires no level shifting when used in the single-supply configuration with a normal CMOS or TTL clock input. 7 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Advanced LinCMOS is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303

Innovative circuit techniques are used on the TLC2652 and TLC2652A to allow exceptionally fast overload recovery time. If desired, an output clamp pin is available to reduce the recovery time even further. The device inputs and output are designed to withstand ­ 100-mA surge currents without sustaining latch-up. Additionally the TLC2652 and TLC2652A incorporate internal ESD-protection circuits that prevent functional failures at voltages V as tested under MIL-STD-883C, Method 3015.2; however, care should be exercised in handling these devices, as exposure to ESD may result in degradation of the device parametric performance. The C-suffix devices are characterized for operation from to 70°C. The I-suffix devices are characterized for operation from to 85°C. The Q-suffix devices are characterized for operation from 40°C to125°C. The M-suffix devices are characterized for operation over the full military temperature range 55°C to125°C.

PACKAGED DEVICES TA VIOmax 25°C 8 PIN SMALL OUTLINE TLC2652AI-8D TLC2652A-8D CERAMIC DIP (JG) PLASTIC DIP (P) TLC2652AIP TLC2652IP SMALL OUTLINE TLC2652I-14D 14 PIN CERAMIC DIP (J) PLASTIC DIP (N) TLC2652IN 20 PIN CHIP CARRIER (FK) CHIP FORM (Y)

The D008 and D014 packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2652AC-8DR). Chips are tested at 25°C.

This chip, when properly assembled, displays characteristics similar to the TLC2652C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform.

TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. PIN (7) IS INTERNALLY CONNECTED TO BACK SIDE OF CHIP. FOR THE PINOUT, SEE THE FUNCTIONAL BLOCK DIAGRAM.