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Part number
3300  13  HYNIX  FBGA  
3630  13  HYNIX  FBGA  


Part information

This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsability for use of circuits described. No patent licenses are implied. Rev. 1.0 /Nov. 2009 1

Revision No. Defined target spec. Updated tRTPS / tRTW / tFAW t32AW / Thermal Characteristics Updated tCKE / Pin Cap / CRCWL / CRCRL/ IDD / PLL Value Updated tRRDL / Revision ID/ Density ID Removed tFLK / tSTDBYLK Updated tCKE / tCKSRE / tCKSRX 6Gbps only) Updated CRCWL / VREFD Selection Coding Auto VREFD Training tCKE & tPD Leakage Current x16 Mode IDD Value

Part numberCircuit descriptionManufacture
H5GQ1H24AFR-T1C 32M X 32 SYNCHRONOUS GRAPHICS RAM, PBGA170. Specifications: Memory Category: DRAM Chip ; Density: 1073742 kbits ; Number of Words: 32000 k ; Bits per Word: 32 bits ; Package Type: BGA, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MO-207DAA-Z, BGA-170
Category: Memory - Memory Chips
SK Hynix
H5GQ1H24AFR-T3C - -


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